Using Ultrasonic SH-Waves to Estimate the Quality of Adhesive Bonds in Plate Structures
Wednesday, March 6, 1985 12:00 p.m. C. H. Yew The University of Texas at Austin A method using SH-waves to estimate the quality of an adhesive layer in a bonded plate is discussed in this talk. A mathematical analysis of SH-wave motions in a bonded plate consistent with the experimental arrangement was carried out in…